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VIETNAM ZIITEK TECHNOLOGY CO.,LTD Vietnam Ziitek Technology Company Limited
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TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

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TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

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Brand Name : Ziitek

Model Number : TIC800G

Certification : UL & RoHS

Place of Origin : Vietnam

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-6 work days

Packaging Details : 24*13*12cm cartons

Products name : Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

Keywords : Phase Change Materials

Density(g/cc) : 2.6

Total Thickness : 0.005"/0.127mm

Applicatoin : Laptop CPU

Thermal conductivity : 5.0W/mK

Feature : Low Thermal Resistant

Color : Gray

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TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

TIC®800G Series is a high-performance, cost-effective thermal interface material featuringa unique grain-oriented structure that enables precise conformity to device surfaces,thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°℃, the material softens and undergoes phase change,effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface,significantly improving heat dissipation performance.

Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment


Applications
> Power conversion equipment

> Power supply and vehicle storage battery
> Large communication switch hardware

> LED TV, Lighting
> Laptop computer

Typical Properties of TIC®800G Series
Product Name TIC®805G TIC®806G TIC®808G TIC®810G TIC®812G Test Method
Color Gray Visual
Thickness 0.005" 0.006" 0.008" 0.010" 0.012" ASTM D374
(0.127mm) (0152mm) (0.203mm) (0.254mm) (0.305mm)
Density 2.6g/cc ASTM D792
Recommended Operating Temperature (℃) -40℃~125℃ Ziitek Test Method
Phase Change Softening Temperature(℃) 50℃~60℃ Ziitek Test Method
Thermal Conductivity 5.0 W/mK ASTM D5470
Thermal Impedance(℃-cm²/W) @50 psi 0.014 0.018 0.02 0.024 0.028 ASTM D5470

Standard Thickness:

0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254 mm),0.012" (0.305 mm)

For other thickness options, please contact us.


Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800G series is supplied with a white release liner and backing pad.

Die-cutting with half-cut processing can include pull tabs.custom-shaped samples are also available.

Pressure-Sensitive Adhesive. lt is not applicable to TIC®800G series products.

Reinforcement Material: No reinforcement materialrequired.

TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.


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