TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
TIC®800G Series is a high-performance, cost-effective thermal interface material featuringa unique grain-oriented structure that enables precise conformity to device surfaces,thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°℃, the material softens and undergoes phase change,effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface,significantly improving heat dissipation performance.
Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment
Applications
> Power conversion equipment
> Power supply and vehicle storage battery
> Large communication switch hardware
> LED TV, Lighting
> Laptop computer
| Typical Properties of TIC®800G Series |
| Product Name | TIC®805G | TIC®806G | TIC®808G | TIC®810G | TIC®812G | Test Method |
| Color | Gray | Visual |
| Thickness | 0.005" | 0.006" | 0.008" | 0.010" | 0.012" | ASTM D374 |
| (0.127mm) | (0152mm) | (0.203mm) | (0.254mm) | (0.305mm) |
| Density | 2.6g/cc | ASTM D792 |
| Recommended Operating Temperature (℃) | -40℃～125℃ | Ziitek Test Method |
| Phase Change Softening Temperature(℃) | 50℃~60℃ | Ziitek Test Method |
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 |
| Thermal Impedance(℃-cm²/W) @50 psi | 0.014 | 0.018 | 0.02 | 0.024 | 0.028 | ASTM D5470 |
Standard Thickness:
0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254 mm),0.012" (0.305 mm)
For other thickness options, please contact us.
Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800G series is supplied with a white release liner and backing pad.
Die-cutting with half-cut processing can include pull tabs.custom-shaped samples are also available.
Pressure-Sensitive Adhesive. lt is not applicable to TIC®800G series products.
Reinforcement Material: No reinforcement materialrequired.
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
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TIC800G Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling Images
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