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VIETNAM ZIITEK TECHNOLOGY CO.,LTD Vietnam Ziitek Technology Company Limited
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TIF035AB-05S High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel

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TIF035AB-05S High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel

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Brand Name : Ziitek

Model Number : TIF035AB-05S

Certification : RoHS

Place of Origin : Vietnam

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-5 work days

Packaging Details : 25*13*12cm carton

Products name : High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel

Thermal conductivity : 3.5W/mK

Hardness : 55 Shore 00

Specific Gravity : 3.1g/cm³

Continuous Use Temperature : -45~200℃

Color : White / Blue

Application : Smart Phone And Tablet Computer

Keywords : Silicon Thermal gel

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TIFTM035AB-05S High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel

TIFTM035AB-05S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.

Feature

< Good thermal conductive: 3.5WW/mK
< Two-part formulation for easy storage
< Exceilent low and high temperature mechanical and chemical stability
< Ultra-conforming low-stress interface application
< Ambient or accelerated cure schedules
< Optimized shear thinning characteristics for ease of dispensing
Applications

< Notebook
< Computer and peripherals

< Telecommunications

< Automotive electronics
< Thermally conductive vibrationd ampening
< Heat sink and any heatgenerating semicondutor

Typical Properties of TIFTM035AB-05S Series
Typical Uncured Material
Property Numerical Test Method
Color/Part A White Visual
Color/Part B Blue Visual
Viscosity as Mixed (cps) 200K Pa.s GB/T 10247
Density 3.1g/cm3 ASTM D792
Mix Ratio 1:1 ******
Shelf Life@25℃ 6 months ******
Cure Schedule
Pot Life @25℃ 30min Ziitek Test Method
Cure @25℃ 16-24hours Ziitek Test Method
Cure @100℃ 30min Ziitek Test Method
Cure Properties
Color Blue Visual
Hardness 55 shore00 ASTM D2240
Continuous Use Temp -45~200℃ ******
Voltage Strength 200V/mil ASTM D149
Dielectric Constant 4.4MHz ASTM D150
Volume Resistivity >1012 Ohm-cm ASTM D257
Flame Rating 94V0 E331100
Thermal Conductivity 3.5W/Mk ISO22007-2
ASTM D5470

Product packing details:
50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing applications. Please contact us for confirming.

TIF035AB-05S High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel

Company Profile

Vietnam Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.


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